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0.8mm board thickness 2-Layer Electronic pcb fast prototype, printed wire layout design
2-Layer pcb fast prototype
1.FR4 with immersion gold
2.1OZ copper thickness
3.0.8mm board thickness
Detailed specification of PCB manufaturing capacity:
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Surface processing type |
HASL/ plating gold /immersion gold/ Ni/Au plating gold finger/OSP processing/immersion Tin /immersion siler |
|
Layers |
single-sided,double-sided,multilayer pcb board |
|
Min trace width |
6mil |
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Min space width |
3.0mil |
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Min trace to pad/pad to pad space |
6mil |
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Min drill diameter |
0.2mm |
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Min via pad |
0.6mm |
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Max board size |
Single and double sides:550mmX1100mm;multilayer:550mmX640mm |
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Molding board thickness |
0.08-0.24mm |
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Min solder mask dam |
6mil |
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Min solder mask clearance |
1.5mil |
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Min solder mask thickness |
10um |
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Solder mask type |
Green/yellow/black/red/white/blue or transparent photosensitive solder mask and peel off blue glue. |
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Min silk legend width |
6mil |
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Min silk legend height |
25mil |
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Silk legend color |
White/ yellow /black |
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Data file format |
GERBER file and corresponding drilling file,PROTEL series,PADS2000,POWERPCB series,ODB++ |
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Electricity performance testing |
100% electrical performance testing,high pressure testing |
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Various types base material to PCB processing |
High TG board, high frequency board(ROGERS,TEFLON) halogen-free board (FR-4,CEM-1,CEM-3) |
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Other testing request |
Impendence testing, Hole resistance testing, gold slice up, Solder ability. |