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ENIG pcb, pcb design, Tg150,Tg170 2-Layer pcb, pcb thickness 0.20mm - 6.0mm
PCB Main Technical Parameters |
|
Item |
Technique data |
Max.Layer |
30 Layers |
Max board size |
550*1100mm |
Board thickness |
0.20mm-6.0mm |
Min.track width |
0.1mm |
Min.space |
0.1mm |
Min.diameter for PTH hole |
0.15mm |
PTH hole dia.tolerance |
0.8+/-0.076mm, 0.8+/-0.10mm |
Hole position tolerance |
±0.05mm |
Insulation resistance |
1000000M Ohm |
Characteristic impedance deviation |
+/-5% |
Through hole resistance |
300 uOhm |
Dielectric strength |
1.6Kv/mm |
Peel-off strength |
1.5N/mm |
Thermal stress |
235+/-5 C,10sec |
Flammability |
94V-0 |
Solderability |
235±5 C,3s |
Board twist |
<0.005mm/mm |
Ionic contamination |
<1.56 ug/cm2 |
Copper thickness |
1/2OZ,1OZ,2OZ,4OZ |
Plating thickness |
25u m-36um |
Materials |
FR-4(Tg150,Tg170, Halogen-free) |