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ENIG pcb, pcb design, Tg150,Tg170 2-Layer pcb, pcb thickness 0.20mm - 6.0mm
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PCB Main Technical Parameters |
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Item |
Technique data |
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Max.Layer |
30 Layers |
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Max board size |
550*1100mm |
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Board thickness |
0.20mm-6.0mm |
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Min.track width |
0.1mm |
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Min.space |
0.1mm |
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Min.diameter for PTH hole |
0.15mm |
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PTH hole dia.tolerance |
0.8+/-0.076mm, 0.8+/-0.10mm |
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Hole position tolerance |
±0.05mm |
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Insulation resistance |
1000000M Ohm |
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Characteristic impedance deviation |
+/-5% |
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Through hole resistance |
300 uOhm |
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Dielectric strength |
1.6Kv/mm |
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Peel-off strength |
1.5N/mm |
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Thermal stress |
235+/-5 C,10sec |
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Flammability |
94V-0 |
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Solderability |
235±5 C,3s |
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Board twist |
<0.005mm/mm |
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Ionic contamination |
<1.56 ug/cm2 |
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Copper thickness |
1/2OZ,1OZ,2OZ,4OZ |
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Plating thickness |
25u m-36um |
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Materials |
FR-4(Tg150,Tg170, Halogen-free) |