Shen Zhen Xu Xin Technology Co., Ltd.

Shenzhen ZhenXian Electronic Technology Co., Ltd. China PCB Manufacture.

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Through - Hole Gold Plating 1 - 16 Layer Electronic PCB Assembly With Electrical Test

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Shen Zhen Xu Xin Technology Co., Ltd.
City:shenzhen
Province/State:guangdong
Contact Person:Mr.
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Through - Hole Gold Plating 1 - 16 Layer Electronic PCB Assembly With Electrical Test

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Place of Origin :Shenzhen, China
Brand Name :ZhenXian
Model Number :CE, ROHS, UL
MOQ :NO MOQ
Packaging Details :Vacuum sealed package
Delivery Time :5-12Days
Payment Terms :T/T,OA, L/C, Western Union
Supply Ability :50000 Square Meter/Square Meters per Month
Certification :UL E354810,SGS
Price :Negotiated
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Through - Hole Gold Plating 1 - 16 Layer Electronic PCB Assembly With Electrical Test

Description:

Layer

1-16

Material

FR4

Thickness

0.2-3.2mm

Surface finishing

HAL/ENIG

Copper

0.5-3oz

Test

Electrical Test


A PCB populated with electronic components is called a printed circuit assembly (PCA), printed circuit board assembly or PCB Assembly (PCBA).

After the printed circuit board (PCB) is completed, electronic components must be attached to form a functional printed circuit assembly, or PCA (sometimes called a "printed circuit board assembly" PCBA). In through-hole construction, component leads are inserted in holes. In surface-mount construction, the components are placed on pads or lands on the outer surfaces of the PCB. In both kinds of construction, component leads are electrically and mechanically fixed to the board with a molten metal solder.

Applications:

Printed circuit board assembly (pcb assembly or pcba) can be used for all kinds of electrical products, such as computer, radio, TV, mobile, mp4, led and so on. It’s widely used in various of industries in the world. We have been pcb/pcba business for ten years and provide different customized pcb to many countries all over the world. Welcome to contact us for further news.

Specifications:

Product Technical Parameter

Basic technology

Parameter

Single/Double sided

Multilayer

Number of Layers

1-2

4~16

Copper Thickness

0.25~3.0OZ

0.5~3.0OZ

Base Board Thickness

0.2~3.2mm

0.6~3.2mm

Incombustibility

94V-0

94V-0

Peelable resistance

12.3N/cm

12.3N/cm

Twist

≤0.5%

≤0.5%

Insulation resistance

≥1011Ω

≥1011Ω

Test voltage

10-300V

10-300V

Finished board area

560×970mm

560×970mm

Min. Line Width and Spacing

0.1/0.1mm

0.1/0.1mm

Copper thickness in hole

≥25.0um

≥25.0um

Mini. pad diameter

Inner layer

 

0.05mm

Out layer

0.076mm

0.076mm

Mini. Hole Diameter

0.25mm

0.20mm

Hole tolerance

PTH

±0.076mm

±0.076mm

NPTH

±0.05mm

±0.05mm

Hole location tolerance

±0.076mm

±0.05mm

profile tolerance

Routing

±0.1mm

±0.1mm

Punching

±0.13mm

±0.13mm

Solder mask bridge ability

≥0.1mm

≥0.075mm

Solder mask rigidity

6H

6H

Solderable test

245℃ 5 second

245℃ 5 second

Thermal cycling ability

288℃ 10 second

288℃ 10 second

Surface Finishing

OSP, HAL, HAL Lead-free, Immersion gold , Gold plating, Rosin, Gold

finger, Immersion Tin and so on

Qaulity standard

IPC-A-600F IPC-ML-950

Sample standard

STD-105E-Ⅱ

Competitive Advantage:

1, Excellent quality control service

2, Competitive price

3, Quick production time

4, PCB design/production/test integrated service

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