Shen Zhen Xu Xin Technology Co., Ltd.
Shenzhen ZhenXian Electronic Technology Co., Ltd. China PCB Manufacture.
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ISO901 electronic low volume 4 layer PCBA / PCB electronic manufacturing assembly services
Specifications
PCB electronic contract manufacturing
1.PCB Layout,PCB design
2. 1-38 layers PCB boards
3. UL, ROHS, T/S16949, ISO14000, ISO9001
4. Markets: worldwide
5. Timely delivery
PCB electronic contract manufacturing
1.PCB Layout,PCB design
2.Make high difficulty PCB(1-38 layers boards)
3.offer all Electric components
4.ISO9001/TS16949/ROHS
5.PCB delivery time:5-10 days; PCBA delivery time:20-25 days
We are professional manufacturer in various PCB and PCBA with many years experience,We can provide a reasonable price with high quality products.
* 1. PCB layout, PCB design
* 2: Make high difficulty PCB(1 to 38 layers)
* 3: Provide all Electronic component
* 4: PCB assembly
* 5: Write programs for clients
* 6: PCBA/finished product Test. etc.
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.Specification for PCBA Manufacture: |
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Item |
FPC |
PCB |
Rigid Flex |
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Layers |
1-8 layers |
1-38 layers |
2-4 layer |
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Board Thickness |
0.05-0.5mm |
0.2-5mm |
0.3-2.2mm |
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Min.line width/space |
0.04/0.04mm |
0.075/0.075mm |
0.1/0.1mm |
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Min.Through Hole Size |
0.2mm |
0.25mm |
0.5mm |
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PTH Hole Dia.Tolerance |
&≤0.8mm 0.05mm |
&≤0.8mm ±0.05mm |
&≤0.8mm ±0.05mm |
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&≥0.8mm ±0.075mm |
&≥0.8mm ±0.075mm |
&≥0.8mm ±0.075mm |
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Solder Mask Registration Tolerance |
±0.05mm |
±0.05mm |
±0.05mm |
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Min.Routing Dimension Tolerance |
±0.05mm |
±0.1mm |
±0.1mm |
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Hole to edge(Hard tool/Die Cut) |
±0.1/±0.2mm |
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Eege to Edge(Hard tool/Die Cut) |
±0.05/±0.2mm |
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Circuit to edge(Hard tool/Die Cut) |
±0.07/±0.2mm |
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Surface Treating Technology |
Electrical Flash Gold,Anti-Tarnish(OSP), |
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Immersion Nickel-gold,HASL,Immersion Tin, |
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2.Details for PCB Assembly
Technical
1).Professional surface mounting and through hole soldering technology;
2).Various sizes,like 1206,0805,0603 components SMT technology;
3).ICT(In Circuit Test),FCT(Functional Circuit Test) technology;
4).Nitrogen gas reflow soldering technology for SMT;
5).High standard SMT&Solder Assembly line;
6).High density interconnected board placement technology capacity.