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CEM-3, ceramic base PCBA / printed circuit pcb assembly for backup board maufacturer
Multilayer PCB Made of FR4;low price pcb manufacturer;High quality pcb manufacturer;Single-sided PCB;Multilayer gold plated pcb, backup board / mainboard for canon pcb /pcb assembly ,pcb,pcba,pcb/pcba manufacturer
We can prvide a package of service:
· 1. PCB layout, PCB design;
· 2: Make high difficulty PCB(1 to 38 layers)
· 3: Provide all Electronic components;
· 4: PCB assembly;
· 5: Write programs for clients;
· 6: PCBA/finished product Test.
· etc…
Specification for PCB Manufacture:
| 
						 Item  | 
					
						 Specification  | 
				
| 
						 Numbr of Layer  | 
					
						 1-38Layers  | 
				
| 
						 Material  | 
					
						 FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic , crockery  | 
				
| 
						 Metal-backed Laminate  | 
				|
| 
						 Remarks  | 
					
						 High Tg CCL Is Availabe(Tg>=170ºC)  | 
				
| 
						 Finish Board Thickness  | 
					
						 0.2mm-6.00 mm(8mil-126mil)  | 
				
| 
						 Minimun Core Thickness  | 
					
						 0.075mm(3mil)  | 
				
| 
						 Copper Thickness  | 
					
						 1/2 oz min;12 oz max  | 
				
| 
						 Min.Trace Width & Line Spacing  | 
					
						 0.075mm/0.1mm(3mil/4mil)  | 
				
| 
						 Min.Hole Diameter for CNC Driling  | 
					
						 0.1mm(4mil)  | 
				
| 
						 Min.Hole Diameter for punching  | 
					
						 0.9mm(35mil)  | 
				
| 
						 Biggest panel size  | 
					
						 610mm*508mm  | 
				
| 
						 Hole Positon  | 
					
						 +/-0.075mm(3mil) CNC Driling  | 
				
| 
						 Conductor Width(W)  | 
					
						 +/-0.05mm(2mil)or  | 
				
| 
						 +/-20% of original artwork  | 
				|
| 
						 Hole Diameter(H)  | 
					
						 PTH L:+/-0.075mm(3mil)  | 
				
| 
						 Non-PTH L:+/-0.05mm(2mil)  | 
				|
| 
						 Outline Tolerance  | 
					
						 +/-0.125mm(5mil) CNC Routing  | 
				
| 
						 +/-0.15mm(6mil) by Punching  | 
				|
| 
						 Warp & Twist  | 
					
						 0.70%  | 
				
| 
						 Insulation Resistance  | 
					
						 10Kohm-20Mohm  | 
				
| 
						 Conductivity  | 
					
						 <50ohm  | 
				
| 
						 Test Voltage  | 
					
						 10-300V  | 
				
| 
						 Panel Size  | 
					
						 110×100mm(min)  | 
				
| 
						 660×600mm(max)  | 
				|
| 
						 Layer-layer misregistration  | 
					
						 4 layers:0.15mm(6mil)max  | 
				
| 
						 6 layers:0.25mm(10mil)max  | 
				|
| 
						 Min.spacing between hole edge to circuity pqttern of an inner layer  | 
					
						 0.25mm(10mil)  | 
				
| 
						 Min.spacing between board oulineto circuitry pattern of an inner layer  | 
					
						 0.25mm(10mil)  | 
				
| 
						 Board thickness tolerance  | 
					
						 4 layers:+/-0.13mm(5mil)  | 
				
| 
						 6 layers:+/-0.15mm(6mil)  | 
				|
| 
						 Impedance Control  | 
					
						 +/-10%  | 
				
| 
						 Different Impendance  | 
					
						 +-/10%  |