Shen Zhen Xu Xin Technology Co., Ltd.
Shenzhen ZhenXian Electronic Technology Co., Ltd. China PCB Manufacture.
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Multilayers FR-4, FR2 PCB layout Assembly & electronics PCBA services
1.PCB Assembly Services
2.ISO9001/TS16949/IPC/ROHS/UL
3.OEM PCB Assembly is welcome!
4.High Quality,Reasonable Price
We can prvide a package of service:
1.Specification for PCB Manufacture:
|
Item |
Specification |
|
Numbr of Layer |
1-38Layers |
|
Material |
FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic , crockery |
|
Metal-backed Laminate |
|
|
Remarks |
High Tg CCL Is Availabe(Tg>=170ºC) |
|
Finish Board Thickness |
0.2mm-6.00 mm(8mil-126mil) |
|
Minimun Core Thickness |
0.075mm(3mil) |
|
Copper Thickness |
1/2 oz min;12 oz max |
|
Min.Trace Width & Line Spacing |
0.075mm/0.1mm(3mil/4mil) |
|
Min.Hole Diameter for CNC Driling |
0.1mm(4mil) |
|
Min.Hole Diameter for punching |
0.9mm(35mil) |
|
Biggest panel size |
610mm*508mm |
|
Hole Positon |
+/-0.075mm(3mil) CNC Driling |
|
Conductor Width(W) |
+/-0.05mm(2mil)or |
|
+/-20% of original artwork |
|
|
Hole Diameter(H) |
PTH L:+/-0.075mm(3mil) |
|
Non-PTH L:+/-0.05mm(2mil) |
|
|
Outline Tolerance |
+/-0.125mm(5mil) CNC Routing |
|
+/-0.15mm(6mil) by Punching |
|
|
Warp & Twist |
0.70% |
|
Insulation Resistance |
10Kohm-20Mohm |
|
Conductivity |
<50ohm |
|
Test Voltage |
10-300V |
|
Panel Size |
110×100mm(min) |
|
660×600mm(max) |
|
|
Layer-layer misregistration |
4 layers:0.15mm(6mil)max |
|
6 layers:0.25mm(10mil)max |
|
|
Min.spacing between hole edge to circuity pqttern of an inner layer |
0.25mm(10mil) |
|
Min.spacing between board oulineto circuitry pattern of an inner layer |
0.25mm(10mil) |
|
Board thickness tolerance |
4 layers:+/-0.13mm(5mil) |
|
6 layers:+/-0.15mm(6mil) |
|
|
Impedance Control |
+/-10% |
|
Different Impendance |
+-/10% |
2.Details for PCB Assembly
Technical
1).Professional surface mounting and through hole soldering technology;
2).Various sizes,like 1206,0805,0603 components SMT technology;
3).ICT(In Circuit Test),FCT(Functional Circuit Test) technology;
4).Nitrogen gas reflow soldering technology for SMT;
5).High standard SMT&Solder Assembly line;
6).High density interconnected board placement technology capacity.