Shen Zhen Xu Xin Technology Co., Ltd.

Shenzhen ZhenXian Electronic Technology Co., Ltd. China PCB Manufacture.

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FR4 Green Solder Mask Heavy Gold Finger Multilayer Custom PCB Boards lead free, OSP

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Shen Zhen Xu Xin Technology Co., Ltd.
City:shenzhen
Province/State:guangdong
Contact Person:Mr.
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FR4 Green Solder Mask Heavy Gold Finger Multilayer Custom PCB Boards lead free, OSP

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Place of Origin :Shenzhen, China
Brand Name :ZhenXian
Model Number :TWS-H0172
Number of Layers :4-Layer
Base Material :FR4
Copper Thickness :Copper Thickness: 0.5Oz 1Oz 2Oz 3Oz
Board Thickness :1.6mm
Min. Hole Size :0.25mm
Min. Line Width :0.1mm
Min. Line Spacing :0.1mm
Surface Finishing :lead free, OSP, HASL, ENIG
soldermask :White/Black/Green/Blue/Red/...
Silkscreen Colour :White/Black/Green/Blue/Red/Yellow...
test :visual inspection, e-test, flying probe test
MOQ :NO MOQ
Packaging Details :Vacuum sealed package
Delivery Time :5-12Days
Payment Terms :T/T,OA, L/C, Western Union
Supply Ability :50000 Square Meter/Square Meters per Month
Certification :UL E354810,SGS
Price :Negotiated
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FR4 Green Solder Mask Heavy Gold Finger Multilayer Custom PCB Boards lead free, OSP

1.PCB Board for Probe Card
2.UL,SGS,RohsCertificated
3.OEM&ODM PCB service offered
4.high qulity impedance


FR4 Green Solder Mask Heavy Gold Finger Multilayer Custom PCB Boards

We manufacture Printed Circuit Board:High quality with competitive price(Good tolerance,Good warpage,Good solderable...)

The information about our company's process capacity for your reference:

Specification Inch (mm)

Material

FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3/CEM-1/Aluminium

Layer No.

1-30

Board thickness

0.015"(0.4mm)-0.125"(3.2mm)

Board Thickness Tolerance

±10%

Cooper thickness

1/2OZ-3OZ

Impedance Control

±10%

Warpage

0.075%-1.5%

Peelable

0.012"(0.3mm)-0.02’(0.5mm)

Min Trace Width (a)

0.005"(0.125mm)

Min Space Width (b)

0.005"(0.125mm)

Min Annular Ring

0.005"(0.125mm)

SMD Pitch (a)

0.012"(0.3mm)

BGA Pitch (b)

0.027"(0.675mm)

Regesiter torlerance

0.05mm

Min Solder Mask Dam (a)

0.005"(0.125mm)

Soldermask Clearance (b)

0.005"(0.125mm)

Min SMT Pad spacing (c)

0.004"(0.1mm)

Solder Mask Thickness

0.0007"(0.018mm)

Hole size

0.01"(0.25mm)-- 0.257"(6.5mm)

Hole Size Tol (+/-)

±0.003"(±0.0762mm)

Aspect Ratio

6:1

Hole Registration

0.004"(0.1mm)

Plating

HASL

2.5um

Lead free HASL

2.5um

Immersion Gold

Nickel 3-7um Au:1-3u''

OSP

0.2-0.5um

Outline

Panel Outline Tol (+/-)

±0.004''(±0.1mm)

Beveling

30°45°

V-cut

15° 30° 45° 60°

Certificate

ROHS ISO9001:2000 TS16949 SGS UL

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