Shen Zhen Xu Xin Technology Co., Ltd.

Shenzhen ZhenXian Electronic Technology Co., Ltd. China PCB Manufacture.

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Custom 2 Layer SMT Multilayer quick turn around CEM-1 / Aluminium pcb board Fabrication

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Shen Zhen Xu Xin Technology Co., Ltd.
City:shenzhen
Province/State:guangdong
Contact Person:Mr.
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Custom 2 Layer SMT Multilayer quick turn around CEM-1 / Aluminium pcb board Fabrication

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Place of Origin :Shenzhen, China
Brand Name :ZhenXian
Model Number :TWS-H0135
Base Material :FR-1,FR-2,FR-4,CEM-1,CEM-3,aluminum...
Copper Thickness :1OZ
Board Thickness :1mm
Min. Hole Size :0.15mm
Min. Line Width :0.12mm
Min. Line Spacing :0.12mm
Surface Finishing :OSP
soldermask :green
MOQ :NO MOQ
Packaging Details :Vacuum sealed package
Delivery Time :5-12Days
Payment Terms :T/T,OA, L/C, Western Union
Supply Ability :50000 Square Meter/Square Meters per Month
Certification :UL E354810,SGS
Price :Negotiated
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Custom 2 Layer SMT Multilayer quick turn around CEM-1 / Aluminium pcb board Fabrication

1.quick turn around pcb
2.with GREEN soldermask
3.UL,SGS,ROHS,IS09001,CEC
4.immersion printing


1.High Quality OSP pcb PANEL BOARD
2.with green soldermask
3.UL,SGS,ROHS,IS09001,CEC
4.Fast delivery with high quality

5.pcb material FR4/ 94vo pcb

We manufacture Printed Circuit Board:High quality with competitive price(Good tolerance,Good warpage,Good solderable...)

The information about our company's process capacity for your reference:

Specification Inch (mm)

Material

FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3/CEM-1/Aluminium

Layer No.

1-30

Board thickness

0.015"(0.4mm)-0.125"(3.2mm)

Board Thickness Tolerance

±10%

Cooper thickness

1/2OZ-3OZ

Impedance Control

±10%

Warpage

0.075%-1.5%

Peelable

0.012"(0.3mm)-0.02’(0.5mm)

Min Trace Width (a)

0.005"(0.125mm)

Min Space Width (b)

0.005"(0.125mm)

Min Annular Ring

0.005"(0.125mm)

SMD Pitch (a)

0.012"(0.3mm)

BGA Pitch (b)

0.027"(0.675mm)

Regesiter torlerance

0.05mm

Min Solder Mask Dam (a)

0.005"(0.125mm)

Soldermask Clearance (b)

0.005"(0.125mm)

Min SMT Pad spacing (c)

0.004"(0.1mm)

Solder Mask Thickness

0.0007"(0.018mm)

Hole size

0.01"(0.25mm)-- 0.257"(6.5mm)

Hole Size Tol (+/-)

±0.003"(±0.0762mm)

Aspect Ratio

6:1

Hole Registration

0.004"(0.1mm)

Plating

HASL

2.5um

Lead free HASL

2.5um

Immersion Gold

Nickel 3-7um Au:1-3u''

OSP

0.2-0.5um

Outline

Panel Outline Tol (+/-)

±0.004''(±0.1mm)

Beveling

30°45°

V-cut

15° 30° 45° 60°

Certificate

ROHS ISO9001:2000 TS16949 SGS UL

- UL, RoHS, ISO, SGS Certification Compliance.

- OEM Assembly, Design, Prototype Service.

- We will be responsible for the quality of our products,

- Survive by quality, Win by Price.

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