Shen Zhen Xu Xin Technology Co., Ltd.
Shenzhen ZhenXian Electronic Technology Co., Ltd. China PCB Manufacture.
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Part:GE-ULS
Material:PI+FR4
Layers: 6L, rigid+flex
Line width/spacing:5/5mil
Surface finish:tin
Finished board thickness: 62+/-7mil
Application: Industrial equipment
We are the professional PCB (1-28 layers), FPC (1-10 layers) and Rigid-Flex (1-12 layers) manufacturer.
Description
1. Professional manufacturer of PCB and PCB assembly, specialized in single-sided PCB, double-sided PCB,
multilayer PCB, PCB layout and design and PCB assembly.
2. Material Type: FR4, CEM-1, non-halogen material, Aluminium Base, Cooper Base, high frequency material ,
Thick copper foil, 94-V0(HB), PI Material, High TG:SL S1000-2,ITEQ:IT180.
3. Surface treatment: HASL, HAL LF, Immersion Gold, Immersion Tin, Immersion silver, Gold Finger, OSP.
Application
Products are applied to a wide range of High-tech industries such as: LED, telecommunication, computer
application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics,
ect. By unremitting work and effort to the marketing, products exports to American, Canada, Europe counties,
Africa and other Asia-pacific countries
Advantage
1. PCB from factory directly
2. PCB which have the comprehensive quality control system
3. PCB with good price
4. PCB with quick turn delivery time from 48hours.
5. PCB with certification (ISO/UL/RoHS/SGS)
6. PCB with 10 years experience in exporting service
7. PCB is no MOQ/MOV.
8. PCB with high quality. strict test through AOI (Automated Optical Inspection),QA/QC, Flying Proble Test,
E-test fixture.
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PCB |
High precision prototype |
PCB bulk production |
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Max Layers |
1-28 layers |
1-14 layers |
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MIN Line width(mil) |
3mil |
4mil |
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MIN Line space(mil) |
3mil |
4mil |
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Min via (mechanical drilling) |
Board thickness≤1.2mm |
0.15mm |
0.2mm |
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Board thickness≤2.5mm |
0.2mm |
0.3mm |
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Board thickness>2.5mm |
Aspect Ration≤13:1 |
Aspect Ration≤ 13:1 |
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Aspect Ration |
Aspect Ration≤13:1 |
Aspect Ration≤ 13:1 |
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Board thickness |
MAX |
8mm |
7mm |
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MIN |
2 layers:0.2mm; 4 layers:0.35mm; 6 layers:0.55mm; 8 layers:0.7mm; 10 layers:0.9mm |
2 layers:0.2mm; 4 layers:0.4mm; 6 layers:0.6mm; 8layers:0.8mm |
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MAX Board size |
610*1200mm |
610*1200mm |
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Max copper thickness |
0.5-6oz |
0.5-6oz |
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Immersion Gold/ Gold Plated Thickness |
Immersion Gold:Au,1—8u” |
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Hole copper thick |
25um 1mil |
25um 1mil |
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Tolerance |
Board thickness |
Board thickness≤1.0mm:+/-0.1mm |
Board thickness ≤1.0mm:+/-0.1
mm thickness≤2.0mm
:+/-10% > 2.0mm:+/-8% |
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Outline Tolerance |
≤100mm:+/-0.1mm |
≤100mm:+/
-0.13mm
+/-0.15mm 0.2mm |
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Impedance |
±10% |
±10% |
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MIN Solder mask bridge |
0.08mm |
0.10mm |
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Plugging Vias capability |
0.25mm--0.60mm |
0.70mm--1.00mm |
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