Shen Zhen Xu Xin Technology Co., Ltd.
Shenzhen ZhenXian Electronic Technology Co., Ltd. China PCB Manufacture.
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Min Thickness (Inner Layer Residue Copper 0.5oz, Resdiue Copper Rate 65%) |
4L |
6L |
8L |
10L |
12L |
14L |
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16 mils |
24 mils |
32 mils |
40 mils |
48 mils |
56 mils |
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Min/Max Layer Count |
Min 2 Layer, Max 20 Layer |
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Min Inner Layer Thickness |
4 mils |
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Min Trace / Space |
4/4 mils Protype 3/3 mils Copper (Thickness 1/ 3oz) |
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Min Finished Hole Size |
8 mils (Aspect Ratio 5) |
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Drilling Accuracy |
±3 mil |
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Lamination Evenness |
±3 mil |
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Min Channel of SMD Pitch |
10 mil |
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Min Channel of SMD Pitch |
8 mil |
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Min DAM Between Fine Pitch |
4 mil |
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Min Space of Soldermask |
4 mil |
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Layer To Layer Registration Tollence |
±3 mil |
±3 mil |
±3 mil |
±3 mil |
±3 mil |
±3 mil |
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Impedance Control Tollance |
100 |
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100 ±10%, 50 ±10% |
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Board Bow / Twist Tolerance |
< 0.75% |
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Min Length (V-Cut) |
2 inch |
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Max Width (V-Cut) |
29 inch |
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Min Width (V-Cut) |
2 inch |
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Min Board Thickness (V-Cut) |
12 mils |
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Golden Finger Max Width Beveling |
70 mils |
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Max Working Size |
29 x 22.44 inch |
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