Shen Zhen Xu Xin Technology Co., Ltd.
Shenzhen ZhenXian Electronic Technology Co., Ltd. China PCB Manufacture.
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We offer quick turn pcb production for our customers:
1-2 layer in 24 hours, 4 layer in 48 hours, 6 layer in 72 hours
Quotation required:
1) Gerber file / PCB file & Bom list
2) Clear pictures of pcb/ fpc/ pcba or pcba sample for us
3) The PCB specification: base material, board thickness, copper thickness, surface finishing, gold immersion thickness, and any other special requirements.
4) Test method for PCB/PCBA
Delivery Time for Hi-frequency PCB
1) Sample within 6 days for high frequency board
2) Normal pcb within 4 days for sample
3) Quick turn PCB within 48 hours
Maximum Process PCB board Capability of Our Company
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Files |
Gerber, Protel, Powerpcb, Autocad, Cam350, etc |
|
Material |
FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic) |
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Layer No. |
1 - 30 Layers |
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Board thickness |
0.0075"(0.2mm)-0.125"(3.2mm) |
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Board Thickness Tolerance |
±10% |
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Copper thickness |
0.5OZ - 4OZ |
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Impedance Control |
±10% |
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Warpage |
0.075%-1.5% |
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Peelable |
0.012"(0.3mm)-0.02’(0.5mm) |
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Min Trace Width (a) |
0.005"(0.125mm) |
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Min Space Width (b) |
0.005"(0.125mm) |
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Min Annular Ring |
0.005"(0.125mm) |
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SMD Pitch (a) |
0.012"(0.3mm) |
|
pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b) |
0.027"(0.675mm) |
|
Regesiter torlerance |
0.05mm |
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Min Solder Mask Dam (a) |
0.005"(0.125mm) |
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Soldermask Clearance (b) |
0.005"(0.125mm) |
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Min SMT Pad spacing (c) |
0.004"(0.1mm) |
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Solder Mask Thickness |
0.0007"(0.018mm) |
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Hole size |
0.01"(0.25mm)-- 0.257"(6.5mm) |
|
Hole Size Tol (+/-) |
±0.003"(±0.0762mm) |
|
Aspect Ratio |
6:01 |
|
Hole Registration |
0.004"(0.1mm) |
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HASL |
2.5um |
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Lead free HASL |
2.5um |
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Immersion Gold |
Nickel 3-7um Au:1-3u'' |
|
OSP |
0.2-0.5um |
|
Panel Outline Tol (+/-) |
±0.004''(±0.1mm) |
|
Beveling |
30°45° |
|
V-cut |
15° 30° 45° 60° |
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Surface finish |
HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink, |
|
Certificate |
ROHS ISO9001:2000 TS16949 SGS UL |
|
Special requirements |
Buried and blind vias, Impedance control, via plug, BGA soldering and gold finger |