Shen Zhen Xu Xin Technology Co., Ltd.

Shenzhen ZhenXian Electronic Technology Co., Ltd. China PCB Manufacture.

Manufacturer from China
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14 Years
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ROHS / UL Blind buried vias pcb 6 layer , FR-4 / AL PCB

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Shen Zhen Xu Xin Technology Co., Ltd.
City:shenzhen
Province/State:guangdong
Contact Person:Mr.
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ROHS / UL Blind buried vias pcb 6 layer , FR-4 / AL PCB

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Place of Origin :Shenzhen, China
Brand Name :ZhenXian
Model Number :HM-Jz007
Min. Line Width :7mil
Min. Line Spacing :6mil
Surface Finishing :HASL
Packaging Details :Vacuum sealed package
Delivery Detail :3-10days
Min. Hole Size :0.25mm
Board Thickness :1.2mm
Copper Thickness :H/H-6OZ
Base Material :FR-4
MOQ :NO MOQ
Price :Negotiated
Delivery Time :5-12Days
Payment Terms :T/T,OA, L/C, Western Union
Supply Ability :50000 Square Meter/Square Meters per Month
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ROHS / UL Blind buried vias pcb 6 layer , FR-4 / AL PCB

Specifications

1.Blind buried via s PCB board.
2.ISO9001:2008, UL certificates.
3.Muiltlayer PCB.
4.Middle and small bulk PCB OEM in China


blind buried via s PCB

  • Layers: Six blind hole PCB
  • Board material: FR-4
  • Board thickness: 1.2mm
  • Surface finish: lead free HASL
  • Solder mask: blue
  • Mininum line width/ line gap: 7mil/6mil
  • Mininum aperture:0.25mm

multi-layer pcb boards for your electronic products.

We are a high-tech enterprise which specializes in developing, manufacturing and marketing pcb.

1.Our product range

single-sided, double-sided, multi-layer, high frequency, MCPCB, metal-backed PCB,etc.

2.Product quality

Our product got ISO9001, UL E320045 certificates and meet RoHS standards.

3.How can we help you?

What we offer is best solutions, to help you improve your quality while maintaining low production cost, but not just products.

The capability:

Item

Specifications

Number of Layer

1-12Layers

Material

FR-4, AL PCB, CEM-1, Taconic, Rogers

Finish Board Thickness

0.2mm-3.2mm(8mil-126mil)

Copper Thickness

1/2 oz min; 6 oz max

Min. Line Width & Spacing

0.075mm/0.1mm(3mil/4mil)

Min. Hole Diameter for CNC Drilling

0.20mm(8mil)

Min. Hole Diameter for Punching

0.9mm(35mil)

Max. Fabrication Area

610mm×508mm (25 inch×21 inch)

ConductorWidth(W)

+/-0.05mm(2mil)

+/-20%of original artwork

Hole Diameter(H)

PTH L:+/-0.075mm(3mil)

Non-PTH L:+/-0.05mm(2mil)

Outline Tolerance

+/-0.15mm(6mil) CNC Routing

+/-0.125mm(5mil) by Punching

Warp & Twist

0.70%

Insulation Resistance

10Kohm-20Mohm

Conductivity

<50ohm

Test Voltage

10-300V

Layer-layer misregistration

4 layers: 0.15mm(6mil) max

6 layers: 0.25mm(10mil) max

Board thickness tolerance

4 layers:+/-0.13mm(5mil)

6 layers:+/-0.15mm(6mil)

Impedance Control

+/-10%

Different Impedance

+-/10%

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