Shen Zhen Xu Xin Technology Co., Ltd.

Shenzhen ZhenXian Electronic Technology Co., Ltd. China PCB Manufacture.

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6 layer HAL / Gold plating pcb control board for usb pcb board

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Shen Zhen Xu Xin Technology Co., Ltd.
City:shenzhen
Province/State:guangdong
Contact Person:Mr.
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6 layer HAL / Gold plating pcb control board for usb pcb board

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Place of Origin :Shenzhen, China
Brand Name :ZhenXian
Model Number :J-061
Copper Thickness :1 OZ
Min. Line Spacing :0.2mm
Solder mask type :Green
Packaging Details :Vacuum sealed package
Delivery Detail :3-7days
Surface Finishing :HAL,Gold plating
Min. Line Width :021mm
Min. Hole Size :0.3mm
Board Thickness :1.6mm
Base Material :FR 4
MOQ :NO MOQ
Price :Negotiated
Delivery Time :5-12Days
Payment Terms :T/T,OA, L/C, Western Union
Supply Ability :50000 Square Meter/Square Meters per Month
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6 layer HAL / Gold plating pcb control board for usb pcb board

Specifications

We offer high quality double side PCB with best price.
We can produce 500 sq metres per day.
FR4 ,1.6mm,1OZ,Gold Plating


1,Our Product range
We offer a wide range of PCBs such as single-sided, double-sided, multi-layer, high frequency, MCPCB, metal-backed PCB and so on.
2,Product quality
Our factories got ISO9001, UL certificates and our products meet RoHS standards.
3,How can we help you?
What we offer is better solutions,to help you inprove your quality while maintaining low production cost, but not just product.
4,Can I ask you three questions?
(1),Do you have plans to import printed circuit board this year?
(2),If so, do you have plan to find an supplier in China?
(3),How can I Be a qualified supplier for you?

Our Factory Manufacture Capability

Item

Manufacture Capability

Material

FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3, Aluminium, Metal based

Layer No.

1-16

Finished Board thickness

0.2 mm-3.8mm’(8 mil-150 mil)

Board Thickness Tolerance

±10%

Cooper thickness

0.5 OZ-6OZ (18 um-210 um)

Copper Plating Hole

18-40 um

Impedance Control

±10%

Warp&Twist

0.70%

Peelable

0.012"(0.3mm)-0.02’(0.5mm)

Images

Min Trace Width (a)

0.075mm (3mil)

Min Space Width (b)

0.1mm (4 mil)

Min Annular Ring

0.1mm (4 mil)

SMD Pitch (a)

0.2 mm(8 mil)

BGA Pitch (b)

0.2 mm (8 mil)

0.05mm

Solder Mask

Min Solder Mask Dam (a)

0.0635 mm (2.5mil)

Soldermask Clearance (b)

0.1mm (4 mil)

Min SMT Pad spacing (c)

0.1mm (4 mil)

Solder Mask Thickness

0.0007"(0.018mm)

Holes

Min Hole size (CNC)

0.2 mm (8 mil)

Min Punch Hole Size

0.9 mm (35 mil)

Hole Size Tol (+/-)

PTH:±0.075mm;NPTH: ±0.05mm

Hole Position Tol

±0.075mm

Plating

HASL

2.5um

Lead free HASL

2.5um

Immersion Gold

Nickel 3-7um Au:1-5u''

OSP

0.2-0.5um

Outline

Panel Outline Tol (+/-)

CNC: ±0.125mm, Punching: ±0.15mm

Beveling

30°45°

Gold Finger angle

15° 30° 45° 60°

Certificate

ROHS, ISO9001:2008, SGS, UL certificate.

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