Shen Zhen Xu Xin Technology Co., Ltd.
Shenzhen ZhenXian Electronic Technology Co., Ltd. China PCB Manufacture.
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Specification
1,base material:FR-4 epoxy resin
2,cooper thickness:1/2OZ 1OZ 2OZ 3OZ(17um 35um 70um 105um)
3,board thickness:0.2-3.2mm
4,min.hole size:0.2mm
5,min.line width/spacing:0.1mm
6,surface finishing:HASL/lead-free HASL
7,form:punching,routing,v-cut,beveling
Our Production Capability For Other PCB
1)Layer:1-16
2)MAX.Board Size For Single/Double-Sided PCB:800*550
3)Solder Mask:green/red/blue/white/yellow.etc,as required
4)Base Material:fr-4,cem-1,cem-3,ceramics,high tg cooper(CCL)
5)Board Thickness:0.2mm-4.5mm
6)Min.Line Width:0.1mm(4mil)
7)Min.Line Space:0.1mm(4mil)
8)Min.Hole Size:0.2mm
9)Surface Finishing:HASL/lead-free HASL,immersion gold/silver/tin,chemical gold,plated gold,OSP,carbon ink,gold finger
10)Hole Plating Tolerance PTH Thickness:>0.025mm
11)PTH Tolerance:±0.075mm
12)NPTH Tolerance:±0.05mm
13)Hole Position Tolerance:±0.05mm
14)Outline Dimension Tolerance:±0.15mm
15)Hole Resistance:<300U
16)Dielectric Strength:>1.6kv/mm
17)Current Breakdown:10A
18)Peel Strength:1.5n/mm
19)Solder Mask Abrasion:>5H
20)Inflammability:94vo
21)Certificate:ISO9002,UL,SGS
22)Special Technology:blind and buried vias,impedance control,BGA,semiconductor vias,silver-filled hole
23)Form:punching,routing,v-cut,beveling
Detailed Terms for Pcb Assembly
Technical requirement:
1) Professional Surface-mounting and Through-hole soldering Technology
2) Various sizes like 1206,0805,0603 components SMT technology
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4) PCB Assembly With UL,CE,FCC,Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity.