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| Specifications | Details |
|
Layer counting |
2-20 layers |
| Process the area the most largely | 550*1000mm |
| Minimum board thickness |
4layers 0.40mm 6layers 0.80mm 8layers 1.0mm 10layers 1.2mm |
| Minimum line space | 0.10mm |
| Hole and wall copper thickness | 0.025mm |
| Metallization aperture public errand | ± 0.08mm |
| Not metallization aperture public errand | ± 0.025mm |
| Hole location public errand | ± 0.05mm |
| Appearance dimension tolerance | ± 0.10mm |
| Weld the bridge minimumly | 0.10mm |
| Insulating resistance | 1E+12Ω(normality) |
| Hot impact | 288 point 20 degrees centigrade(second) |
| Twist and crooked | ≤0.7% |
| Resist the electirc intensity | >1.3KV/mm |
| Resist the intensity of stripping | 1.4N/mm |
| Hinder the intensity of the solder flux | >6H |
| Fire-restardant | 94V-0 |
| Impedance Controlling | ±5% |
Flex PCB Production Capacity:
Layers 1-6Layers
Min Thickness 0.08mm
Min Line Width 0.05mm
Min Hole size 0.15mm PTH
Surface Treatment ENIG,Gold Plating,HAL,Plaing Pb-Sn