Shen Zhen Xu Xin Technology Co., Ltd.
Shenzhen ZhenXian Electronic Technology Co., Ltd. China PCB Manufacture.
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Automotive printed circuit board
We can manufacture PCB in high quality,more competitive price,quicker delivery and better logistic service... Welcome to sent us RFQ!
1.Automotive printed circuit board
2.good quality,reasonable price
3.quicker delivery
4.UL,ISO9000,ISO14000,Rosh
| Item | Parameter | |||
| Max. Layers | 30 Layers | |||
| Aspect Ratio | 16:01 | |||
| Min. Line Width (mil) | 3 | |||
| Min. Line Space (mil) | 3 | |||
| Min. Annular Ring (mil) | Via Hole : 3mil | |||
| IC Hole : 5mil | ||||
| Min. Hole Size | Boards thickness<2.0mm | 0.2mm | ||
| Boards thickness<1.2mm | 0.1mm | |||
| Boards thickness≥2.0mm | Aspect Ratio ≤ 10 | |||
| Max. Board Thickness | Single, Double-Layer | 8.0mm | ||
| Multilayer | 8.0mm | |||
| Min. Board Thickness | Single, Double-Layer | 0.2mm | ||
| Multilayer | 4 layers | 0.4mm | ||
| 6 layers | 0.6mm | |||
| 8 layers | 1.0mm | |||
| 10 layers | 1.2mm | |||
| Max. Size | Single, Double-Layer | 600*1100 mm | ||
| Multilayer | 600*1100 mm | |||
| Min. Space Between Line and Edge | Routing0.20mm | |||
| V-cut:0.4mm | ||||
| V-cut:0.33mm ( thickness<1.2mm) | ||||
| Base Material | FR-4, High Frequency, PTFE (Teflon), Aluminum Base Material, Copper Base Material, Thick Copper, Halogen-Free, Arlon, Rogers, CEM-1, CEM-3, Ceramics, Flexible, Rigid-Flex | |||
| Solder Mask(SM) | SM Opening (mil) | 2/4 | ||
| SM Bridge (mil) | 6 | |||
| Color | White, Black, Blue, Green, | |||
| Yellow, Red, etc. | ||||
| Silk Screen | Min. width (mil) | 5/8 | ||
| Color | White, Yellow, Black, etc. | |||
| Surface Treatment | HASL, Lead-free HASL, ENIG, Electroplating Au, Immersion Silver, Immersion Tin, OSP, etc. | |||
| Plating Thickness (Micro inch) | Type | Layer | Min. Thickness | Max. Thickness |
| Electroplating Au | Ni | 100 | 600 | |
| Au | 1 | 3 | ||
| ENIG | Ni | 80 | 150 | |
| Au | 1 | 3 | ||
| Gold Finger Plating | Ni | 80 | 150 | |
| Au | 5 | 50 | ||
| Plating Thickness In Hole (Micro) | Thick | 18-20 | 50 | |
| Base Copper | Inner / Outer (OZ) | 0.5 | 6 | |
| Finished Copper Thickness | Outer | 1 | 8 | |
| Inner | 0.5 | 6 | ||
| Solder Mask Thickness | 0.06 | |||