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CREST Professional printed circuit board Manufacturer/Factory
1.base material:FR-4 epoxy resin
2.cooper thickness:1/2OZ 1OZ 2OZ 3OZ(17um 35um 70um 105um)
3.board thickness:0.2-3.2mm
4.min.hole size:0.2mm
5.min.line width/spacing:0.1mm
6.surface finishing:HASL/lead-free HASL
7. form:punching,routing,v-cut,beveling
Capability of factory for bare PCB
| NO | ITEM | Technical Data | 
| 1 | Layer | 2-20 Layers | 
| 2 | Board material | FR4,FR4 Halogen free,TEFLON Rogers,Getek High-TG(TG>170),Aluminium base | 
| 3 | Max.Board Size0 | 457*660mm | 
| 4 | Min.Board Thickness | 2 layers 0.2mm | 
| 4 layers 0.4mm | ||
| 6 layers 0.8mm | ||
| 8 layers 1.0mm | ||
| 10 layers 1.2mm | ||
| 5 | Max.Board Thickness | 8.0mm | 
| 6 | Min.Line Width | 0.05mm | 
| 7 | Min.Line Space | 0.05mm | 
| 8 | Min.Hole Size0 | Electroplating Via 0.15mm | 
| Micro via 0.075mm | ||
| 9 | PTH Wall Thickness) | 20-25um | 
| 10 | Max.finish copper thickness0 | 8OZ | 
| 11 | PTH Dia.Tolerance | ±0.05mm | 
| 12 | NPTH Dia.Tolerance | ±0.025mm | 
| 13 | Hole Position Deviation | ±0.05mm | 
| 14 | Outline Tolerance | ±0.1mm | 
| 15 | Min.S/M Pitch | 0.08mm | 
| 16 | Insulation Resistance | 3x10Sec, 288°C | 
| 17 | Warp and Twist | ≤0.7% | 
| 18 | Electric Strength | >1.3KV/mm | 
| 19 | Peel Strength | ≥1.4N/mm | 
| 20 | Solder Mask Abrasion | ≥6H | 
| 21 | Flammability | 94V0 | 
| 22 | Impedance Control | ±5% |